ASML wants to deliver euv chip machines in 2019




for more than 155 wafers per hour
ASML is making progress in increasing the production of its euv machines for making chips. In the second half of next year the NXE: 3400C should appear, which can handle 155 wafers per hour.

Currently there are several NXE: 3400B machines active at ASML customers that run more than 125 wafers per hour, even though the Veldhoven company does not state whether this is an average. ASML has set an average of 125 wafers per hour as the minimum limit for mass production.

TSMC wants to use euv next year for its second generation of 7nm chip production. ASML now reports on the publication of its quarterly figures that it has its services in order for that mass production and that the availability of the euv machines has improved even further, without mentioning statistics. The goal is to have them operational more than 90 percent of the time.

ASML delivered five euv machines last quarter and received orders for another five machines. In the next quarter, six systems will have to leave the production facility in Veldhoven, bringing the total to eighteen for the whole of 2018. In 2019 ASML wants to deliver a total of thirty euv systems.

The semiconductor industry is busy with the transition from the current immersion lithography to euv lithography. In immersion lithography, layers with chip structures on the wafer surface are projected by light with a wavelength of 193nm, but the limits for further reduction come into view. Euv machines use extreme ultraviolet light with a wavelength of 13.5 nm so that smaller structures can be applied. TSMC and Samsung are in the process of integrating their processes for chip production, Intel adopts a wait-and-see attitude and GlobalFoundries has dropped out.

ASML achieved sales in the past quarter of 2.78 billion euros and made a profit of 680 million euros.


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