Cooling microprocessors will be engaged in carbon nanotubes




Cooling microprocessors will be engaged in carbon nanotubes

A group of researchers from the Lawrence National Laboratory, which has been curated by the Department of Energy United States , Berkeley, announced that it has developed new technology to use carbon nanotubes to build cooling systems for microprocessors.

Scientists say that their method is very simple and can easily be adapted for mass production of such cooling systems. Recall that carbon nanontrubki valued by scientists for their reverse the physical and chemical properties. You can either grow or produce from the two-dimensional graphene sheets rolled.

Modern microprocessors are able to cope with an extremely difficult task. However, this possibility is less probability of separating a huge amount of heat. Without quality cooling billions of transistors placed on an area of ​​a few square centimeters, can easily become hot to the boiling point of water.

Now cooled processors themselves in different ways, ranging from the use of thermal conductivity paste and coolers and ending with liquid cooling system. In some cases, even liquid nitrogen or dry ice, but it is only in those cases where a categorical cooling (maximum overclocking). However, the use of carbon nanotubes, according to scientists, the efficiency of cooling systems can be increased many times compared with the cooling systems, which are now available on the market.

The head of this study is Ogltri Frank, Head of Materials at the Lawrence National Laboratory. The main task, which coped researchers was to determine connectivity ligands (electron pair donors, or just a bridge) carbon nanotubes and the metal surface by an elastic microprocessor covalent bond.

As a result of these manipulations, the team noted a 600 percent increase in the volume of the heat flux transmitted from the microprocessor. Accession nanotubes to the metal surface obtained through the use of gas under pressure and low temperature liquid chemicals, which implies the possibility of adapting this method using the manufacturers of microprocessors.

“We create covalently bonded path running from oxide materials such as alumina and silica, as well as a noble metal like copper and gold”, – said Ogltri.

“In both cases we see an improvement in the coupling surfaces between the nanotubes and the processor, which ultimately greatly improves heat transfer through the interface” – adds the scientist.

Full details of this technique have been published in the scientific journal Nature Communications.
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Метки: Будущее , Микропроцессоры , Нанотехнологии , Углеродные nanotubes .

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