First USB 3.1 products come on the market from 2015




At the Intel Developer Conference in San Francisco that will be.’s First USB 3.1 chips produced mid-2014 From other planning relating to the specification, it can be seen that the first official products may appear on the market. 2015 at the earliest

USB 3.1 offers significant speed improvements over USB 3.0. The transfer speed of 5 Gbit / sec doubled to 10 Gbit / sec. The net rate would even come to lie, even higher as the data is encrypted more efficiently. USB 3.1 is also backwards compatible with USB 2.0 and USB 3.0, but the new standard requires w USB SuperSpeed+ el improved connections and cables, the cables are likely to be due to the higher overhead. slightly shorter

The U SB Implementers Forum, the organization responsible for the USB standard, Heise has the Intel Developer Conference update data on the progress of the USB 3.1 deployment. From this it can be seen that all connected with USB-IF manufacturers have begun the development of the first USB 3.1 chips, but that they are ready mid 2014.

Then these chips tested and certified so that they can wear. SuperSpeed ​​+ logo This step will be ready at the end of 2014. This means that the first official products that use USB 3.1 can be released. Probably at the earliest in 2015 on the market Intel’s next-generation code-named Skylake bears, appears too early to even USB 3.1 support, which means that only the successor Skylake will support the newer standard expected Heise.



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