Intel and Micron end after 2019 collaboration for making 3D XPoint memory




Micron and Intel have announced that they will continue their existing collaboration to produce 3D Xpoint memory until the first half of 2019, once the second generation of technology is completed. Then they go their own way.

This means that the existing joint venture between Intel and Micron for the production of 3D Xpoint memory will probably be lifted from the second half of 2019 or sometime thereafter. Both companies say that they will independently develop the third generation of 3D Xpoint memory. They opt to optimize the technology for their own business needs.

Micron and Intel are currently involved in 3D Xpoint production at the Intel-Micron Flash Technologies plant in the American city of Lehi, Utah. Even after the termination of the collaboration, the companies seem to want to use IMFT fab for the production of the memory.

Intel creates 3D XPoint memory under the Optane denominator, while that of Micron carries the name QuantX. QuantX has not yet been released, while 50 percent of the production of the IMFT fab is for Micron. At the beginning of this year it became clear that both companies are also going to end their cooperation in the field of 3d-nand memory .


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