Intel Skylake get support for USB 3.0 as chip interconnect




Details about the complete line of Intel’s upcoming chipset Skylake platform came online. Motherboards for the successor of Broadwell get include support for SuperSpeed ​​USB Inter-Chip USB 3.0 that the basis for chip-to-chip interconnects is.

The Intel slides where VR-Zone managed to lay hand on, it appears that Intel wants to completely switch to the 100 Series chipsets for desktop processors in 2015. Thus, the Z97 and H97 again succeeded by the Z170 and the H170 and H110 must serve the budget segment, although the latter in the third instead of the second quarter.

Intel Series 100 Skylake roadmap

The Z170 and H170 of the 100 Series chipsets successively for the high-end and mainstream market go about support available for 10 and 8 USB 3.0 ports, respectively. Will be that of the two USB 3.0 ports can be used as ssic. Allocated for all chipsets

This interconnect provides a considerable reduction in consumption and an increase in the throughput to chip-to-chip communications with respect to standards such as standards such as GPIO, and mipi HSIC. Ssic by the USB-IF alliance include developed in collaboration with the organization that maintains standards for the mobile industry, the MIPI Alliance.

Skylake processors are manufactured on 14nm Broadwell like but have a completely new architecture, which consider Broadwell as a variant of Haswell on a smaller manufacturing process is. Skylake processors are combined with an LGA 1151 socket and gain include support for DDR4.


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