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Intel used again as a solder thermal interface material in Haswell-E
Intel used for at least the most powerful Haswell-E-processor solder instead of thermal paste. That discovered the website OCDrift when removing the roof of the upcoming Core i7-5960X, who got the site already owned.
When OCDrift the IHS of the Core of the i7-5960X Haswell-E-generation removed , it appeared that the that on the roof was soldered with a strong epoxy. The site calls it good news for overclockers, because solder for better heat conductivity than makes thermal paste.
At Ivy Bridge and Haswell Intel thermal paste used as a thermal interface material, and this led to higher temperatures than expected, especially where overclockers were not happy with it. When K Haswell processors with unlocked multiplier Intel did make a new generation of Polymer Thermal Interface Material use that improvement must, but the Haswell-E series seems to go back to the manufacturer so. solder
Haswell-E is probably in September. Earlier reports show that it is the Core i7-5960X-octacore and two hexacores with TDP of 140W, and support for DDR4.
Intel Core i7-5960X OCDRiftViewing:-185
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