Layer graphene made usable for cooling electronics




A group of scientists has successfully found a way to use graphene layers for cooling electronics. The heat conductivity is four times better than that of copper and the layers may be easily applied to chips.

Research from the Chalmers University of Technology shows the layers of graphene as a replacement to serve more traditional cooling methods. Although all was previously known that this is possible, there are still several problems had to be overcome to be able to bring the actually in practice. Specifically, the scientists made sure that they could let their layers of graphene ‘stick’ on silicon, or the material with which chips are made.

Earlier it was a clear only in very thin layers of graphene possible to enter into a connection with the silicon. That was because the compounds were established with Vander Waal Bindings, a relatively weak connection between molecules. However, the scientists of Chalmers have succeeded in to let the graphene bind to silicon by means of covalent bonds: between atoms which are compounds wherein there is an electron pair, and such connections are much stronger. In order to obtain covalent bonds were molecules (3-aminopropyl) triethoxysilane was added to the graphene.

By entering into covalent bonds with the applied layer of graphene can be so much thicker than previously possible. Therefore so it can also lead away greater amounts of heat from the chip, and that makes it more attractive to also in actually as cold pasta put graphene in practice. The researchers demonstrated that their method provides a cooling capacity of four times that of copper. If and when manufacturers start using layers of graphene for electronics cooling is not clear.

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