Micron and Intel Announce 3D NAND flash chips




Micron and Intel have announced that they are the first samples of 3D NAND flash chips are sent to manufacturers and that will come later this year, the production of the stacked flash chips on stream. The 3D flash chips make SSDs possible with storage capacities of 10TB.

Intel announced last year that it was working with Micron to 3D NAND chips. In addition, not only memory cells but also next to each other placed on one another. The design of the two chip companies contains 32 layers, representing a capacity of 256 gigabits in either 32GB MLC-NAND chips. If chosen tlc flash chips capacity increases to 48GB or 384 gigabit.

Micron and Intel propose that the new 3D flash chip design in a normal SSD 10TB or more is possible for storage. A USB stick could accommodate such a 3TB. In addition to the increased capacity, the two companies that the chips also cheaper to produce, making the cost of flash storage could decline. In addition, in a package that’s different loosely at each other or are disabled, with positive consequences for the power consumption in standby or at a low load as a result.

Both companies now say they started the production of 3D NAND flash chips. The first products should be out later this year on the market. There are also all samples sent to partners of Intel and Micron.


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