Qualcomm lodge a complaint against the company mezzo Beijing Court of Intellectual Property

Jun

25

2016

Qualcomm ‘s chip industry has announced its submission of a complaint in the Beijing Intellectual Property Court against the smart phone industry company mezzo MEIZU, after the inability of the two companies to reach a licensing agreement.

This comes after the company backed mezzo company on the door using the patents belonging to Qualcomm related to the production of devices supports communication standards for the third generation 3G and fourth-generation 4G / LTE technologies.

The Qualcomm has entered into a settlement with the National Committee of the Chinese reform and development after the breach of the company’s anti-monopoly law in China, to the later settle its dispute over its agreement to pay $ 975 million dollars.

Qualcomm asked the court to confirm that a patent license agreement terms consistent with the anti-monopoly law in China and obligations of fair and non-discriminatory licensing under the settlement agreement, which has with the Commission in 2015.

The Qualcomm in the words of General Counsel Don Rosenberg as negotiated extensively and in good faith with the mezzo company to sign a patent licensing in accordance with the terms and conditions of the correction plan submitted by Qualcomm Commission agreement.

He added that the chancellor has made mezzo using techniques owned intellectual Qualcomm without paying them fairly, and complete that Qualcomm does not focus on the damage but wish to reach a settlement serve everyone.

The mezzo company, which is headquartered in the Chinese city of Zhuhai, as the eighth largest manufacturer of smart phones in China for 2015, which has, according to market research firm IDC data device to ship 24.8 million for this year.

Qualcomm Inc. has signed a license with about 100 Chinese manufacturer company for smartphones agreements, the company is seeking to deepen its presence in the Chinese market through the transfer of technology and investment in manufacturing generation chips Ia.

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