Scientists develop efficient electronics cooling grafeennanovlokjes

Apr

30

2016

Researchers have developed a film which can conduct heat well by adding a low grafeennanovlokjes. This will allow more heat to dissipate in electronics and other devices that can lose heat difficult.

The examination of the Chalmers University of Technology in Sweden, even though nearly so far devised a pilot to the film into production, is close, says John Liu, one of the authors of the article. In doing so, the group made ​​progress since the discovering of a way to be able to arrange better graphene on chips in order to ensure as for cooling.

The quality of the thermal conductivity of the film increased considerably if there is a functional layer with grafeennanovlokjes was added to it, in comparison with a film without such a layer. This is mainly because the contact resistance is drastically reduced by the layer.

Research through simulations of the layers and the method of heat transfer, have already shown that the material could potentially work well to dissipate heat. The functional layer with the grafeennanovlokjes close off the heat, as it were and gives movements of not point to the other layers within the crystalline structure.

The researchers demonstrated inter alia, that the temperature at the hottest point of a test chip having a thermal element operating at 1300W / cm² about 28 ° C could be brought down, from 135 to 107 degrees. The grafeenfilm is used in the chip as a heat spreader and is bonded to the silicon dioxide. If the graphene was not used in the floc-shape, the temperature difference was 17 degrees. The flakes so made another 11 degrees extra cooling.

The article can be again found in Nature Communications.

Schematic representation nano flakes

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