Toshiba and Sandisk make 48-layer 256Gbit 3d flash memory




Sandisk and Toshiba have with their joint venture for flash memory achieved a new milestone in the development of 3D NAND flash called ‘Bics. It is the companies succeeded in their 48-layer 3D nand of 128Gbit- to 256Gbit-tlc to scale up.

That writes Toshiba Tuesday on its website. The stacked memory companies want the storage include SSD considerably screwing and still keep prices low. The joint venture is developing behind the Samsung 32-layer-128Gbit TLC and MLC modules shipped. Micron and Intel come with mass-produced 3D NAND modules 256Gbit mlc-and-384Gbit TLC at the end of this year and SK Hynix begins in the third quarter of this year with the production of 36-layer NAND MLC memory of 128Gbit.

The joint venture was in May 2014 announced , and developed earlier this year 2bit-per-cell memory of 128Gbit or 16GB. The 256Gbit or 32GB, 48-layer memory 3bit per cell, the first samples appear in September this year. The only real production is gaining momentum after the new Fab 2 facility in Japan Yokkaichi perfect in the first half of 2016. The plant will be built specially for the production of 3D NAND. The former Fab 2 plant was demolished for 2014. The first products with the Toshiba / Sandisk memory will until the end of 2016 to find their way out.


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