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Unobtrusive wearable electronics – that’s the future
It looks like that worn by the electronics of the future will be more like plastic wrap, rather than the Google Glass. Already developed chip-tattoo and flexible electronic devices, are dissolved in water . Scientists at Tokyo University, in turn, created a “virtually invisible” thin and flexible electronics, writes scientific resource Scientificamerican.
Many research groups are working in this direction. We also learned how to create the largest, flexible and delicate electronics – says the author of Martin Kaltenbrenner.
The first prototype wearable sensor 30 times lighter paper printer is 5 times thinner edible film of the same size. According to Takao Someya, one of the participants in the study, people do not even feel it for yourself.
The basis of the new sensor is the polymer substrate (PEN – polyethylene napthalate) thickness of 1 micron. A film roll width of 10 cm and a length – 10 km. This film is used in the mass production of capacitors.
Scientists have managed to fix the main flaw PEN-film – too rough, visible only under a microscope. Kaltenbrenner and his colleagues found that when properly applied layers of electronic elements, lack becomes an advantage: the film is well fastened metal. This allows you to produce delicate electronics with high strength properties.
Prototype tactile sensor consists of a piece of film PEN-size 4.8 square centimeters single layer integrated circuit layer 144 and the tactile schemes.
All together about 1-2 microns. This increases the flexibility of the sensor.
The “invisible” electronic devices can be used in medicine, robotics and other fields. The developers are confident that in the future, such electronics will become a familiar sight.
This is the same edible film roll, with only functional electronic device. Functionalized can be almost anything. Enough to wrap the subject of the film – says Kaltenbrenner.
Something similar is developed , scientists at UC Berkeley .
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Tags: Flexible electronics , wearable electronics , University of Tokyo
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