Western Digital storage technology poses BiCS3 the first of its kind in the world

Jul

28

2016

It announced that Western Digital on Tuesday for its success in the next generation of NAND development of a technique known as three – dimensional: BiCS3 backed storage capacities of 64 vertical layer.

US specializing in storage solutions company said that pilot production of the new technology has begun to “Yokkaichi,” the joint industrial facilities in Japan, and is expected to begin initial production later this year. Western Digital also expects to put up large amounts of BiCS3 technology in the first half of 2017.

Said Dr. Siva Sivaram, Executive Vice President at the Department of Memory techniques in Western Digital: The BiCS3 technology on the principle of using 3-bit per cell, as well as other advanced technologies in the field of processing high percentages of semiconductors in order to provide the capabilities of the top and high performance reliable and affordable support “.

Western Digital storage technology poses BiCS3 the first of its kind in the world

Sivaram said: “annexation of new BiCS2 expand Nand three-dimensional techniques lineup has contributed dramatically, which enhances our ability to meet the needs of the full range of customers in the area of ​​retail and mobile devices and data centers of sale applications.”

This is expected to be BiCS3 IT application, developed in collaboration with Western Digital partner for technology and manufacturing: Toshiba, with capacities of 256 GB initially, and will be available in a range of capacities up to 500 GB per chip.

Expects Western Digital supply BiCS3 shipments to retail markets in the last quarter of 2016, and begin to distribute OEM samples in this quarter, while still supplying the previous generation of NAND technology shipments of three-dimensional: BiCS2 going on to customers in the retailer market as well as the distribution of OEM samples .

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